| NO | Develop Period | Processed Item | Company | Related Parts | Remarks |
|---|---|---|---|---|---|
| 1 | 91.09-92.07 | Electroless nickel plating | Motorola | Lead Pin | Substitute import |
| 2 | 91.11-92.05 | Thin plating | Molex | Connector Pin | Substitute import |
| 3 | 91.05-92.09 | Solid lubricating film | Doosan Heavy Industries & Construction |
Closure Stud | Substitute import |
| 4 | 95.06-96.02 | Anodized film | Process | Valve Spool | Substitute import |
| 5 | 96.02-96.10 | Mg Chromate | Process | Mc Corrosion Resistance | Substitute import |
| 6 | 97.06-98.02 | Anodized film | Process | Cylinder | Process technology |
| 7 | 99.08-99.12 | Anodized film | Process | CSC Body | Process technology |
| 8 | 99.04-00.10 | Mg Non-Chromate | Process | Non-Chromate | Substitute import |
| 9 | 04.12-05.11 | Mg Anodizing | Process | Mg Base Ano. | Substitute import |
| 10 | 06.10-07.03 | Electroless nickel plating | Chemical | ES-Ni plating | Substitute import |
| 11 | 07.05-07.06 | Electroless nickel plating | Process | P/shaft | Process technology |
| 12 | 08.01-08.02 | AL Electroless nickel plating | Process | Spool Valve | Substitute import |
| 13 | 08.01-08.12 | AZ31 Mg multi-layer plating | Process | Mg(AZ31) Panel | Process technology |
| 14 | 09.01-09.10 | AL ANO+Cu+Ni plating | Process | PCB | Process technology |
| 15 | 11.10-12.01 | KASHIMA Coating technology | Process | AL Lubrication | Progress |
| 16 | 14.01-14.04 | AL alloy high corrosion resistance non-chromate |
Process | AL Alloy (Samsung Electronics) |
Process technology |
| 17 | 15.01-16.03 | MASF | Process | AL Insert Injection, Waterproof Function |
Process technology |
| 18 | 17.03-18.08 | Development of pretreatment agent | Chemical | AI Desiccant | Technology development |
| 19 | 20.01-20.08 | Release agent development | Chemical | Ni Plated Release Agent | Technology development |