R&D

R&D Achievements

NO Develop Period Processed Item Company Related Parts Remarks
1 91.09-92.07 Electroless nickel plating Motorola Lead Pin Substitute import
2 91.11-92.05 Thin plating Molex Connector Pin Substitute import
3 91.05-92.09 Solid lubricating film Doosan Heavy Industries
& Construction
Closure Stud Substitute import
4 95.06-96.02 Anodized film Process Valve Spool Substitute import
5 96.02-96.10 Mg Chromate Process Mc Corrosion Resistance Substitute import
6 97.06-98.02 Anodized film Process Cylinder Process technology
7 99.08-99.12 Anodized film Process CSC Body Process technology
8 99.04-00.10 Mg Non-Chromate Process Non-Chromate Substitute import
9 04.12-05.11 Mg Anodizing Process Mg Base Ano. Substitute import
10 06.10-07.03 Electroless nickel plating Chemical ES-Ni plating Substitute import
11 07.05-07.06 Electroless nickel plating Process P/shaft Process technology
12 08.01-08.02 AL Electroless nickel plating Process Spool Valve Substitute import
13 08.01-08.12 AZ31 Mg multi-layer plating Process Mg(AZ31) Panel Process technology
14 09.01-09.10 AL ANO+Cu+Ni plating Process PCB Process technology
15 11.10-12.01 KASHIMA Coating technology Process AL Lubrication Progress
16 14.01-14.04 AL alloy high corrosion resistance
non-chromate
Process AL Alloy
(Samsung Electronics)
Process technology
17 15.01-16.03 MASF Process AL Insert Injection,
Waterproof Function
Process technology
18 17.03-18.08 Development of pretreatment agent Chemical AI Desiccant Technology development
19 20.01-20.08 Release agent development Chemical Ni Plated Release Agent Technology development